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Processing (Older)
1. Recipe Library
2. Fabrication Fundamentals
3. Equipment Selection
3. IEN Process Search
3. Standard Operation Procedure
About Staff
Al Etching
Annealing
Au Etching
BLE Spinner
Cambridge NanoTech ALD (left)
Cambridge NanoTech Plasma ALD - Right (non-metal)
Characterization based on Industry Standards
Chemical Dry Etch
Chemical Vapor Deposition (CVD)
Chemicals Inventory
Cr Etching
Cu Etching
Denton Infinity
Developers Provided
Development
Dicing
Direct Write
Dry Etching
Electroless Plating
Electroplating
Flipchip Bonding
General Safety
Georgia Valve and Fitting
Incident Report
Instructional Lab Tools
K&S 4522 - Au Ball Bonding
K&S 4523A - Al Wedge Bonding
Karl Suss RC8 Spinner - Marcus
Karl Suss RC8 Spinner - Pettit
Laser MicroMachining Technologies
Laurel Spinner
LPCVD
Materials
Metal Etchants
Oxidizer
Photoresist
Remover
Solvents
Thin Film Materials
Materials
Metal Deposition
Metal Etchants
New Laser Proposal
Other Developers
Oxford ICP PECVD - Oxide
Oxford PECVD
Oxford PECVD Left - Amorphous Silicon
Oxford PECVD Left - Carbide
Oxford PECVD Right - Oxide
Oxford PECVD Right - Standard Nitride Recipe
P / N Doping
Parker
Parylene
Plasma Etching
Plasma Therm PECVD - Standard Nitride Recipe
Plasma Therm PECVD - Standard Oxide Recipe
Plasma Therm SLR RIE
Polisher / Lapper
Polisher/Lapper
Polymer
Polymer Curing/Sintering
Polysilicon
Process Flow
Process Flow
Processing Help
PVD75 Filament Evaporator
Radiation Safety
Rapid Thermal Process
Recipe Library
Remote Processing
Research Capabilities
Resists
SCS Spincoater Processing Tab
SDS Database
Semiconductor
Silicon Dioxide Etching
Silicon Nitride Etching
STS AOE ICP
STS PECVD 2
STS PECVD 2 - Oxide
Suess AltaSpray Coater
Thermo Oxidation
Thin Film Materials
Titanium Etching
Tool Selection
Tutorials
Tystar Poly Furnace 3
Unaxis PECVD
Vision RIE 1
Wet Bench Chemicals
Wet Etching
Wire Bonding
XeF2 Etching
Thin Film Materials
Metals
Au - Gold
Gold
Chemical Properties
Boiling Point: 2970C
Melting Point: 1948C
Ag - Silver
Silver
Chemical Properties
Boiling Point:3924C
Melting Point: 1763C
Cu - Copper
Copper
Chemical Properties
Boiling Point: 4644C
Melting Point: 1984C
Ni - Nickel
Nickel
Chemical Properties
Boiling Point: 5275C
Melting Point: 2650C
Pt - Platinum
Platinum
Chemical Properties
Boiling Point: 6917C
Melting Point: 3215C
Ti - Titanium
Titanium
Chemical Properties
Boiling Point: 5948C
Melting Point: 3034C
Fe - Ion
Iron
Chemical Properties
Boiling Point: 5184C
Melting Point: 2800C
Al - Aluminum
Aluminum
Chemical Properties
Boiling Point: 4566C
Melting Point: 1221C
Cr - Chromium
Chromium
Chemical Properties
Boiling Point: 4841C
Melting Point: 3465C
Mo - Molly
Molybdenum
Chemical Properties
Boiling Point: 8382C
Melting Point: 4753C
W - Tungsten
Tungsten
Chemical Properties
Boiling Point: 10,030C
Melting Point: 6,191C
Semiconductors
Oxides
Al2O3 - Aluminum Oxide
Aluminum Oxide
Chemical Properties
Boiling Point: 5390C
Melting Point: 3760C
SiO2 - Silicon Oxide
Silicon Dioxide
Chemical Properties
Boiling Point: 4046C
Melting Point: 2912C
TiO2 - Titanium Oxide
Titanium Dioxide
Chemical Properties
Boiling Point: 5382C
Melting Point: 3349C
HfO2 - Hafnium Oxide
ZrO2 - Zirconium Oxide
ZnO - Zinc Oxide
Zinc Oxide
Chemical Properties
Boiling Point: 4280C
Melting Point: 3587C
MgO - Magnesium Oxide
Magnesium Oxide
Chemical Properties
Boiling Point: 4046C
Melting Point: 2912C
IGZO - Indium-Garllium-Zinc Oxide
ITO - Indium Tin Oxide
Indium Tin Oxide
Chemical Properties
Melting Point: 2200C
TEOS - Tetraethyl Orthosilicate
Nitrides
TiN - Titanium Nitride
SiN - Silicon Nitride
Silicon Nitride
Chemical Properties
Melting Point: 2912C
HfN - Hafnium Nitride
AlN - Aluminum Nitride
Silicon Nitride
Chemical Properties
Melting Point: 2912C
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