3. Equipment Selection -

3. Equipment Selection

Ellipsometry	Profilometry	Scanning Electron Microscopy
Stress Analysis	Particle Analysis	Surface Charge Analysis
Electrical Signal Tests	Microscopes	X-Ray Inspection

Thin Film Deposition

Atomic Layer Deposition (ALD)	Chemical Vapor Deposition (CVD)	Physical Vapor Depostion (PVD)
Plating Methods	Graphene/CNT	Printing Methods
	Parylene

Chemical Dry Etch	Chemical Wet Etch	Plasma Etch

High Temperature Process

LPCVD	Polymer Curing/Sintering	Thermal Oxidation
Rapid Thermal Process (RTP)	Diffusion	Doping
	Annealing

IC Assembly	Polisher/Lapper	Wafer Bonders
	Dicing Saw

Resist Coater	Hotplate/Ovens	Mask Aligners
	Direct Write Lithography

Contact Information

Hang Chen, Ph.D.
Process Support Manager
The Institute for Electronics and Nanotechnology at Georgia Tech
345 Ferst Drive, Atlanta GA, 30332 | 1152
404.894.3360 | hang.chen@ien.gatech.edu