Wire Bonding

Wire bonding is an interconnect technology where the chip's active side is facing up and a wire connects the electrodes on the chip to the substrate's electrodes. It is a current standard interconnect in industry. Often for testing, an IC ceramic socket is used to make signals from the chip to the test setup easier. A die attach material is need to keep the chip in place as well as thick enough electrodes to absorb the energy during a bond. It is recommended to have at least a xxx nm Au layer on top of the electrode for wire-bonding purposes. Also after wire-bonding, a protective paryalene coating can be used.