IMS- Micro/Nano Fabrication Facility
Processing (Older)
Flipchip Bonding

Flipchip Bonding

Flipchip bonding is an interconnect technology which the chip's active side faces down toward the substrate. Depending on the interconnect type, the stackup for the chip's electrode 

Below is a document with general rule design guideline for flipchip bonding and during the inital chip design following a few of the guidelines will make testing easier. Sign in is required.

 

Contact Information
Hang Chen, Ph.D.
Process Support Manager
The Institute for Electronics and Nanotechnology at Georgia Tech
345 Ferst Drive, Atlanta GA, 30332 | 1152
404.894.3360 | hang.chen@ien.gatech.edu