IMS- Micro/Nano Fabrication Facility
Processing (Older)
Plasma Therm PECVD - Standard Nitride Recipe
Equipment
          EquipmentPlasma-Therm PECVD

Manufacturer:Plasma-Therm Inc.

ModelWafer/Batch 790 Series

Platen Size8 in



Recipe

Recipe Name:STDNIT.prc    

Gas2% Silane in Nitrogen   200 sccm


Ammonia      5.0 sccm


Nitrogen       900 sccm

Pressure900 mtorr

Temperature250°C

Power30 W



Resultsa

Deposition Rate:140 Å/minb

Uniformity:0.64%c

Refractive Index at 633nm:1.8675d

Stress Level:N/Ae




a: All data is updated as the date indicated above

b: An average value from 15 min deposition

c: Film thickness variation across a 4” wafer, defined as (max-min)/average

d: An average value across a 4” wafer

e: Measured with optical stress measurement tool