Photoresist

Photoresists Provided

	Microposit s1813
	Positive photoresist that is optimized for g-line exposure and is effective for broad-band exposure.

	Chemical Properties
	Viscous Flammable Neutral pH Boiling Point: 145.8/295C Stable under normal conditions Avoid high temperatures and static discharge Incompatible with oxidizing agents

	Microposit s1827
	Positive photoresist that is optimized for g-line exposure and is effective for broad-band exposure.

	Chemical Properties
	Viscous Flammable Neutral pH Boiling Point: 145.8/295C Stable under normal conditions Avoid high temperatures and static discharge Incompatible with oxidizing agents

	Megaposit SPR220 - 7.0
	General purpose, multi-wavelength resist designed to cover a wide range of film thicknesses (1-30 um) with a single coat process.

	Chemical Properties
	Excellent adhesion and plating characteristics Ideal for MEMs and bump processes Broadband, g-line and i-line capable >10 um film thickness in a sinngle coat with good uniformity Au, Cu, Ni/Fe plating without cracking Recommended to use HMDS for adhesion to some substrates

	Futurrex NR9-1500py
	Negative photoresist designed for 365 nm wavelength exposure. It shows negative sloping sidewall profiles and allows for simple resist lift off process.

	Chemical Properties
	Single layer lift off process to pattern metals and dielectrics without RIE Sensitivity to wavelengths shorter than 380 nm Superior resolution capability Fast develop time Temperature resistance of up to 100C

	Futurrex NR71-3000py
	Negative photoresist designed for 365 nm wavelength exposure. It shows negative sloping sidewall profiles and allows for simple resist lift off process.

	Chemical Properties
	Straight resist sidewall profile Fast develop time Superior resolution capability Temperature resistance of up to 180C Superior selectivity in RIE process Does not require HMDS

Other Photoresists

	SU8 100 Series
	High contrast, epoxy based photoresist

	Chemical Properties
	Very high optical transparency above 360 nm Ideal for imaging vertical sidewalls

	SU-8 2000 Series
	High contrast, epoxy based photoresist

	Chemical Properties
	Thick, chemically and thermally stable Very high optical trannsmission above 360 nm Ideal for imaging

AZ p4620

The AZ P4000 positive resist series with its members AZ P4110, AZ P4330, AZ P4620 and AZ P4903 have two main characteristics:

An improved adhesion to all common substrates for a higher stability for e. g. wet etching or plating
A lower photo active compound concentration which allows the application of thick and very thick resist films (approx. 3 - 30 µm)

Other characteristics:

Steep wall profiles, high aspect ratios
Sensitive to g-, h-, and i-line
Recommended developers: KOH-based (e. g. AZ 400K) or TMAH-based (e. g. AZ 826 MIF)
Standard strippers (e. g. AZ 100 Remover, TechniStrip P1316)
Thinner and edge bead remover: AZ EBR Solvent = PGMEA

AZ P4110

Resist film thickness range: Approx. 2 - 5 µm
Sales units: gallons (small sales volumes such as 250 ml, 500 ml or 1000 ml on request)

AZ P4330

Resist film thickness range: Approx. 3 - 8 µm
Sales units: gallons (small sales volumes such as 250 ml, 500 ml or 1000 ml on request)

AZ P4903

Resist film thickness range: Approx. 8 - 30 µm
Sales units: gallons (small sales volumes such as 250 ml, 500 ml or 1000 ml on request)

Development

AZ® 400K 1 : 4 or AZ® 826 MIF recommended