K&S 4523A - Al Wedge Bonding

	Equipment
	Equipment	K&S 4523A Wedge Bonder
	Manufacturer:	Karl Suss
	Model	4523A SemiAuto
	Wire Material	Aluminum
	Wire Diameter	25 um

	Substrate
	Substrate Size	6" x 6" maximum
	Wire Length	10 mm maximum
	Pad Size	100 um minimum
	Pad Spacing	50 um minumum

	Bonding Parameters^a,b
	Tail	8
	Loop	6
	Search 1	4
	Power 1	7
	Time 1	8
	Force 1	5
	Search 2	7
	Power 2	8
	Time 2	8
	Force 2	5
	Ball Size	6
	Temperature	up to 130 C

a: The parameters well worked in the past b: Optimized for bonding to ENIG plated FR4 200 um pads

Contact Information

Hang Chen, Ph.D.
Process Support Manager
The Institute for Electronics and Nanotechnology at Georgia Tech
345 Ferst Drive, Atlanta GA, 30332 | 1152
404.894.3360 | hang.chen@ien.gatech.edu