IMS- Micro/Nano Fabrication Facility
Processing (Older)
K&S 4522 - Au Ball Bonding
 Equipment
           EquipmentK&S 4522 Ball Bonder

Manufacturer:Karl Suss

Model4522

Wire MaterialGold

Wire Diameter25 u



 Substrate

Substrate Size 6" x 6" maximum

Wire Length 10 mm maximum

Pad Size 100 um minimum

Pad Spacing 50 um minumum



 Bonding Parametersa,b

Tail 8

Loop 6

Search 1 4

Power 1 7

Time 1 8

Force 1 5

Search 2 7

Power 2 8

Time 2 8

Force 2 5

Ball Size  6

Temperatureup to 130 C

a: The parameters well worked in the past

b: Optimized for bonding to ENIG plated FR4 200 um pads

Contact Information
Hang Chen, Ph.D.
Process Support Manager
The Institute for Electronics and Nanotechnology at Georgia Tech
345 Ferst Drive, Atlanta GA, 30332 | 1152
404.894.3360 | hang.chen@ien.gatech.edu