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Processing (Older)
1. Recipe Library
2. Fabrication Fundamentals
3. Equipment Selection
3. IEN Process Search
3. Standard Operation Procedure
About Staff
Al Etching
Annealing
Au Etching
BLE Spinner
Cambridge NanoTech ALD (left)
Cambridge NanoTech Plasma ALD - Right (non-metal)
Characterization based on Industry Standards
Chemical Dry Etch
Chemical Vapor Deposition (CVD)
Chemicals Inventory
Cr Etching
Cu Etching
Denton Infinity
Developers Provided
Development
Dicing
Direct Write
Dry Etching
Electroless Plating
Electroplating
Flipchip Bonding
General Safety
Georgia Valve and Fitting
Incident Report
Instructional Lab Tools
K&S 4522 - Au Ball Bonding
K&S 4523A - Al Wedge Bonding
Karl Suss RC8 Spinner - Marcus
Karl Suss RC8 Spinner - Pettit
Laser MicroMachining Technologies
Laurel Spinner
LPCVD
Materials
Metal Etchants
Oxidizer
Photoresist
Remover
Solvents
Thin Film Materials
Materials
Metal Deposition
Metal Etchants
New Laser Proposal
Other Developers
Oxford ICP PECVD - Oxide
Oxford PECVD
Oxford PECVD Left - Amorphous Silicon
Oxford PECVD Left - Carbide
Oxford PECVD Right - Oxide
Oxford PECVD Right - Standard Nitride Recipe
P / N Doping
Parker
Parylene
Plasma Etching
Plasma Therm PECVD - Standard Nitride Recipe
Plasma Therm PECVD - Standard Oxide Recipe
Plasma Therm SLR RIE
Polisher / Lapper
Polisher/Lapper
Polymer
Polymer Curing/Sintering
Polysilicon
Process Flow
Process Flow
Processing Help
PVD75 Filament Evaporator
Radiation Safety
Rapid Thermal Process
Recipe Library
Remote Processing
Research Capabilities
Resists
SCS Spincoater Processing Tab
SDS Database
Semiconductor
Silicon Dioxide Etching
Silicon Nitride Etching
STS AOE ICP
STS PECVD 2
STS PECVD 2 - Oxide
Suess AltaSpray Coater
Thermo Oxidation
Thin Film Materials
Titanium Etching
Tool Selection
Tutorials
Tystar Poly Furnace 3
Unaxis PECVD
Vision RIE 1
Wet Bench Chemicals
Wet Etching
Wire Bonding
XeF2 Etching
Solvents
Solvents Provided
Acetone
Acetone
Colorless, volatile, flammable liquid that is used as a solvent for stripping photoresists and cleaning residue from wafers.
Chemical Properties
Boiling Point: 56C
Melting Point: -94C
Water soluble
Methanol
Methanol
Colorless, volatile, flammable liquid that is used as a solvent for dissolving a wide range of non-polar compounds.
Chemical Properties
Boiling Point: 64.7C
Melting Point: -98C
Highly toxic
Isopropanol
Isopropanol
Colorless, volatile, flammable liquid that dissolves a wide range of non-polar compounds.
Chemical Properties
Evaporates quickly
Leaves zero oil traces
Relatively non-toxic
Boiling Point: 180C
Melting Point: -128C
Trichloroethylene
Trichloroethylene
Colorless, non-flammable liquid that is an effective solvent for a variety of organic materials.
Chemical Properties
Reacts with strong oxidizinng and reducing agents
Boiling Point: 87.2C
Melting Point: -73C
Toxic
Other Solvents
Dichlorobenzene
Dichlorobenzene
Solvent that softens and removes carbon-based contamination on metal surfaces
Chemical Properties
Colorless
Poorly soluble in water
Miscible with most organic solvents
Boiling Point: 180C
Methanoxyethanol
Methoxyethanol
Solvent that dissolves a variety of different types of chemical compounds
Chemical Properties
Colorless, clear
Miscible in water and other solvents
Incompatible with strong oxidizers
Boiling Point: 124-125C
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MEK
MEK
Solvent that is used as a cleaning agent that dissolve many different substances
Chemical Properties
Also known as butanone or methyl ethyl ketone
Colorless
Soluble in water
Boiling Point: 79C
MIBK
MIBK
Solvent that is used to dissolve polymers
Chemical Properties
Methyl isobutyl ketone
Colorless
Low solubility in water
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