IMS- Micro/Nano Fabrication Facility
Processing (Older)
Metal Deposition

Sputterers

CVC DC Sputterer

Location: Pettit Cleanroom

Substrate Size: < 6 in

Number of Substrates Allowed: ?

Number of Crucibles: ?

Metals AvailableAl, Cr, Cu, Ag, Fe, Ni,

Pd, Pt, Ru, Ag, Ta, Ti, W

Special Features:

Two 3" and two 8" sputter guns;

            

  


PVD75 RF Sputterer

Location: Marcus Inorganic Cleanroom

Substrate Size: < 12 in

Number of Substrates Allowed: 1 - 3

Metals AvailableAl, Cu, Ag, Fe, Ni, Pt

Special Features:

Sputter two or more dissimilar 

materials simultaneously;

            

  

 

 


Denton Discovery RF/DC Sputterer

Location: Marcus Inorganic Cleanroom

Substrate Size: < 4 in

Number of Substrates Allowed: 1 - 4

Number of Crucibles: ?

Depositions Available: Al2O3, SiO2,

In2O3, Al, Cr, Cu, Ta, Ti, W, Si, ZnO

Special Features:

The system is equipped with two 3" DC

target positions and two 3" RF targets;

            

  


Unifilm Sputterer

Location: Marcus Inorganic Cleanroom

Substrate Size: < 4 in

Number of Substrates Allowed: 1

Number of Crucibles: ?

Metals Available: Al, Al/Si, Au, Ti, Cr,

Cu, Mo, Mo/Cu, Ni, Si, Ta

Special Features:

High quality;

            

  

 


ALD

Cambridge NanoTech Plasma ALD - Metal

Location: Marcus Inorganic Cleanroom

Substrate Size: < 8 in

Number of Substrate Allowed: 1 – 3

Depositions AvailableAl, ZnO, Pt, AlN, AlO3

Special Features:

Ultra high aspect ratios;

Film thickness can be controlled to

within 1nm

 

 


E-beam Evaporators

CVC E-Beam Evaporator 2

Location: Instructional Center

Substrate Size: < 4 in

Number of Substrates Allowed: ?

Number of Crucibles: ?

Metals AvailableTi, Cr, Au, Ni, Al, Cu, 

Fe, Ag, Mo, W, Sn, Sr, Pd, CdSe

Special Features

 

            


Denton Explorer E-beam Evaporator

Location: Marcus Inorganic Cleanroom

Substrate Size:  4 in or smaller

Number of Substrates Allowed: 3

Number of Crucibles: 6

Metals AvailableAu, Pt, Ti, Cr, Cu,

Al, Fe, Ni, Pd, Ag, Sn

Special Features

Substrates flip-over during deposition;

Auto beam alignment

            


CHA E-beam Evaporator 2 (metals)

Location: Marcus Inorganic Cleanroom

Substrate Size: < 4 in

Number of Substrates Allowed: 3

Number of Crucibles: 6

Metals AvailableTi, Au, Cr, Ni, Al, Cu, 

Fe, Ag, Sn, Pd

Special Features:

      Provides very little coating to the sides of any features     


CVC E-Beam Evaporator 1

Location: Pettit Cleanroom

Substrate Size: < 4 in

Number of Substrate Allowed: 1 – 20

Number of Crucibles: ?

Metals AvailableTi, Cr, Au, Ni, Pt,

Al, Cu, Fe, Ag, W, Sn, Sr, Pd, Ge, V,

NiCr, Nb, Bi, In

 

  

 


Filament Evaporator

Denton Infinity

Location: Marcus Inorganic Cleanroom

Substrate Size: ?

Number of Substrate Allowed: 1 – 3

Number of Crucibles: ?

Depositions Available: Cr, Cu, Ti

Special Features:

Ability to deposit on both sides of wafer;

 

 

 


PVD75 Filament Evaporator

Location: Marcus Inorganic Cleanroom

Substrate Size: < 4" wafer

Number of Substrate Allowed: 1 – 3

Depositions Available: Al, Cr, Cu, Au, Fe, Ni, Pt, Ag, Sn, Ti

Special Features

 Use of boats/wires to melt materials


Plating Station

Plating Station Overview

Location: Marcus Inorganic Cleanroom

Materials Allowed: Cu, Ni, Fe, Solder,

             Au (with permission)