IMS- Micro/Nano Fabrication Facility
Processing (Older)
Photolithography

Spinners

Spinners Comparison

Equipment NameLocationTypeSubstrate SizeHas Hotplate
 BLE Spinner Marcus Manual 4 in; 6 in yes
 SCS G3P8 Marcus; Pettit Manual small piece, 4 in; 6 in No
 Karl Suss RC8 - Marcusb Marcus Auto 4 in Yes
 Karl Suss RC8 - Pettitb Pettit Manual 4 in; 6 in No
 Laurel Spinnera Marcus Manual small piece only No



 a: Laurel Spinner is dedicated for PZT and other ferroelectric spin-coating

 b: No SU-8 is allowed


BLE Spinner

Location: Marcus Inorganic Cleanroom

Substrate Size: 4" and 6" wafers

Special Features:

Computer controlled interface

Speeds up to 5000 rpm

Any type of photoresist can be used 




 

 


Karl Suss RC8 Spinner - Marcus

Location: Marcus Inorganic Cleanroom

Substrate Size: < 6 in

Number of Substrates Allowed: one 4" wafer

Special Features:

100 - 5000 RPM  

  

 

 

 

 

 

 



Karl Suss RC8 Spinner - Pettit

Location: Pettit Cleanroom

Substrate Size: < 6 in

Number of Substrates Allowed: one 4" wafer

Special Features:

100 - 5000 RPM  

  

 

 

 

 

 

 


SCS G3P8 Spin Coater 1

Location: Marcus Inorganic Cleanroom

Substrate Size: small pieces to 4"

Special Features:

0 - 5000 RPM

Multiple small chucks with varying sizes for small pieces

  

 

 


SCS G3P8 Spin Coater 2

Location: Pettit Cleanroom

Substrate Size: small pieces to 4"

Special Features:

0 - 5000 RPM

Multiple small chucks with varying sizes for small pieces

  

 

 

 

 


SCS G3P8 Spin Coater 3

Location: Marcus Inorganic Cleanroom

Substrate Size: small pieces to 4"

Special Features:

0 - 5000 RPM

Multiple small chucks with varying sizes for small pieces

  

 



Laurel Spinner

Location: Marcus Inorganic Cleanroom

Substrate Size: small pieces - 4" wafer

Number of Substrates Allowed: 1

Special Features:

PZT and ferrorelectric spin coating;  

  

 

 

 

 

 

 


Mask Aligners

Mask Aligner Overview

Equipment NameLocationWavelengthSubstrate SizeBackside AligntmentResolution
Karl Suss TSA MA-6Marcus 365nm; 405nm   
Karl Suss MA-6 - MarcusMarcus 365nm; 405nm; 248nm   
Karl Suss MA-6 - PettitPettit 365nm; 405nm   
EVG 620Marcus 365nm   
OAIPettit 365nm   



Karl Suss TSA MA6 Mask Aligner

Location: Marcus Inorganic Cleanroom

Substrate Size: < 6 in

Number of Substrates Allowed: 1

Special Features:

 Top side alignment only

  

 

 

 

 

 


Karl Suss MA-6 Mask Aligner - Marcus

Location: Marcus Inorganic Cleanroom

Substrate Size: < 6 in

Number of Substrates Allowed: 1

Special Features:

 Topside and backside alignment


Karl Suss MA-6 Mask Aligner - Pettit

Location: Pettit Cleanroom

Substrate Size: < 6 in

Number of Substrates Allowed: 1

Special Features:

  Topside and backside alignment


EVG 620 Mask Aligner

Location: Marcus Inorganic Cleanroom

Substrate Size: 4" wafer

Number of Substrates Allowed: 1

Special Features:

  365 nm only


OAI Mask Aligner

Location: Pettit Cleanroom

Substrate Size: < 8 in

Number of Substrates Allowed: 1

 


Spray Coater

Suss AltaSpray Spray Coater

Location: Marcus Inorganic Cleanroom

Substrate Size: up to 8 in

Photoresist Allowed:

AZ4620; NR71-3000p;  SC1827 

Special Features:

Coat resist on sidewalls and corners;

Fill trenches up to 2:1 aspect ratio;

No soft-bake needed


Hotplates

Ovens


Image Reversal Oven

Location: Marcus Inorganic Cleanroom

Substrate Size: up to 8in

Temperature: ?

Pressure: ?

Special Features:

Ammonia pattern exposure;

Undercut profiles for lift-off


VWR Oven

Location: Marcus Inorganic Cleanroom

Substrate Size

Number of Substrates Allowed: ?

Special Features:

Vacuum oven;


Thermo Scientific Precision Oven

Location: Marcus Inorganic Cleanroom

Substrate Size

Temperature: ?

Special Features:


Laser Writer

Microtech Laserwriter LW405

Location:Marcus Inorganic Cleanroom

Max Work Area: 150mm x 150 mm

Position Accuracy: 0.1 um

Minimum Line Width: 0.8 um

Exposure Wavelength: 405 nm