Polisher/Lapper
Location: Marcus Lapper & Polishing Room
Substrate Size:
Special Features:
Extremely precise and versatile lapping;
Wax bonder to secure wafer to glass;
Wafer Bonders
Location: Marcus Inorganic Cleanroom
Substrate Size: 4" and 6" wafers
High alignment accuracy and precision;
Substrate Size: < 6 in
Anodic fusion, adhesive;
Thermal compression;
Wire Bonder
Location: Assembly Lab
Aluminum wire wedge bonder;
Substrate Size: ?
Number of Substrates Allowed: ?
25 micron gold wire;
80 micron ball size;
Location: Marcus Lapper & Polishing
Room
Wedge wire bonder;
Semi/fully automatic;
Flip Chip Bonders
Location: Pettit lab 248
Substrate Size: < 4 in
.1 - 20N bond force;
< 400C;
Rough alignment and placement;