IMS- Micro/Nano Fabrication Facility
Processing (Older)
Packaging

Polisher/Lapper

Logitech PM5 Polisher 1

Location: Marcus Lapper & Polishing Room

Substrate Size

Special Features:

 

 

            


Logitech LP50 Lapper

Location: Marcus Lapper & Polishing Room

Substrate Size

Special Features:

Extremely precise and versatile lapping;

 


Logitech SS Bonder

Location: Marcus Lapper & Polishing Room

Substrate Size

Special Features:

Wax bonder to secure wafer to glass;

 


Wafer Bonders

Karl Suss SB6 Bonder

Location: Marcus Inorganic Cleanroom

Substrate Size: 4" and 6" wafers

Special Features:

High alignment accuracy and precision;

 

            

  

 

 

 

 


Karl Suss SB8E Bonder

Location: Marcus Inorganic Cleanroom

Substrate Size: < 6 in

Special Features:

Anodic fusion, adhesive;

Thermal compression;

 

            

  

 

 

 


Wire Bonder

K&S 4523A Wedge Wire Bonder

Location: Assembly Lab

Substrate Size

Special Features:

Aluminum wire wedge bonder;

 

            

  

 



K&S 4522 Ball Bonder

Location: Assembly Lab

Substrate Size: ?

Number of Substrates Allowed: ?

Special Features:

25 micron gold wire;

80 micron ball size;            

  

 

 


K&S 1472 Wire Bonder 1

Location: Marcus Lapper & Polishing

Room

Substrate Size: ?

Number of Substrates Allowed: ?

Special Features:

Wedge wire bonder;

Semi/fully automatic;            

  

 


K&S 1472 Wire Bonder 2

Location: Marcus Lapper & Polishing

Room

Substrate Size: ?

Number of Substrates Allowed: ?

Special Features:

Wedge wire bonder;

Semi/fully automatic;            

  

 


Flip Chip Bonders

Finetech Sub-micron Flip-chip Bonder

Location: Pettit lab 248

Substrate Size: < 4 in

Number of Substrates Allowed: ?

Special Features:

.1 - 20N bond force;

< 400C;            

  


Dage Shear Tester

Location: Assembly Lab

Substrate Size

Number of Substrates Allowed: ?

Special Features:

      


BGA Rework Station

Location: Assembly Lab

Substrate Size

Number of Substrates Allowed: ?

Special Features:

Rough alignment and placement;