IMS- Micro/Nano Fabrication Facility
Processing (Older)
Packaging

Wafer Bonding

Karl Suss SB8E - Anodic Bonding

Equipment
          EquipmentKarl Suss SB8E

Manufacturer:Karl Suss

ModelSB8E Wafer Bonder

Substrate Size6" and 8" wafer



 Bonding Parametersa,b

Step 1

 

Top Temp (C)

50


Bot Temp (C)

50

Pressure/Vac (kPa)

100

Tool Pressure (kPa)

0

Voltage (V)

0

Alarm (min)

30 

Action

Contact




Step 2



Top Temp (C)50

Bot Temp (C)

50

Pressure/Vac (kPa)

5e-4

Tool Pressure (kPa)

0

Voltage (V)

0

Alarm (min)

30

Action

N/A




Step 3

Top Temp (C)50

Bot Temp (C)50

Pressure/Vac (kPa)5e-4

Tool Pressure (kPa)0

Voltage (V)0

Alarm (min)30

ActionClamps




Step 4

Top Temp (C)

50

Bot Temp (C)50

Pressure/Vac (kPa)

5e-4

Tool Pressure (kPa)0

Voltage (V)0

Alarm (min)30

ActionSpacers



 

Step 5

 
 Top Temp (C) 350
 Bot Temp (C) 350 
 

Pressure/Vac (kPa) 

5e-4 
 Tool Pressure (kPa) 
 Voltage (V) 
 Alarm (min) 150 
 Action  
   
 Step 6  
 Top Temp (C) 350
 Bot Temp (C) 350 
 Pressure/Vac (kPa) 5e-4 
 Tool Pressure (kPa) 
 Voltage (V) 
 Alarm (min)90 

Action ToolDown




Step 7

Top Temp (C)350

Bot Temp (C)350

Pressure/Vac (kPa)5e-4

Tool Pressure (kPa)150

Voltage (V)-750

Alarm (min)90

ActionE1




Step 8

Top Temp (C)350

Bot Temp (C)350

Pressure/Vac (pKa)5e-4

Tool Pressure (pKa)150

Voltage (V)0

Alarm (min)90

Action




Step 9

Top Temp (C)350

Bot Temp (C)350

Pressre/Vac (pKa)5e-4

Tool Pressure (pKa)150

Voltage (V)-1200

Wait (min)45

Alarm (min)105

ActionE12




Step 10

Top Temp (C)100

Bot Temp (C)100

Pressure/Vac (pKa)

5e-4

Tool Pressure (pKa)0

Voltage (V)0

Alarm (min)90

ActionN/A




Step 11

Top Temp (C)100

Bot Temp (C)100

Pressure/Vac (pKa)5e-4

Tool Pressure (pKa)0

Voltage (V)0

Alarm (min)90

ActionToolUp




Step 12

Top Temp (C)50

Bot Temp (C)50

Pressure/Vac (pKa)100

Tool Pressure (pKa)0

Voltage (V)0

Alarm (min)270

ActionN/A


Karl Suss SB8E - Thermal Compression

 Equipment
          EquipmentKarl Suss SB8E

Manufacturer:Karl Suss

ModelSB8E Wafer Bonder

Substrate Size6" and 8" wafer



 Bonding Parametersa,b

Step 1

 

Top Temp (C)

50


Bot Temp (C)

50

Pressure/Vac (kPa)

100

Tool Pressure (kPa)

0

Voltage (V)

0

Alarm (min)

30 

Action

Contact




Step 2



Top Temp (C)50

Bot Temp (C)

50

Pressure/Vac (kPa)

5e-4

Tool Pressure (kPa)

0

Voltage (V)

0

Alarm (min)

30

Action

N/A




Step 3

Top Temp (C)50

Bot Temp (C)50

Pressure/Vac (kPa)5e-4

Tool Pressure (kPa)0

Voltage (V)0

Alarm (min)30

ActionClamps




Step 4

Top Temp (C)

50

Bot Temp (C)50

Pressure/Vac (kPa)

5e-4

Tool Pressure (kPa)0

Voltage (V)0

Alarm (min)30

ActionSpacers



 

Step 5

 
 Top Temp (C) 350
 Bot Temp (C) 350 
 

Pressure/Vac (kPa) 

5e-4 
 Tool Pressure (kPa) 
 Voltage (V) 
 Alarm (min) 150 
 Action  
   
 Step 6  
 Top Temp (C) 350
 Bot Temp (C) 350 
 Pressure/Vac (kPa) 5e-4 
 Tool Pressure (kPa) 
 Voltage (V) 
 Alarm (min)90 

Action ToolDown




Step 7

Top Temp (C)350

Bot Temp (C)350

Pressure/Vac (kPa)5e-4

Tool Pressure (kPa)150

Voltage (V)-750

Alarm (min)90

ActionE1




Step 8

Top Temp (C)350

Bot Temp (C)350

Pressure/Vac (pKa)5e-4

Tool Pressure (pKa)150

Voltage (V)0

Alarm (min)90

Action




Step 9

Top Temp (C)350

Bot Temp (C)350

Pressre/Vac (pKa)5e-4

Tool Pressure (pKa)150

Voltage (V)-1200

Wait (min)45

Alarm (min)105

ActionE12




Step 10

Top Temp (C)100

Bot Temp (C)100

Pressure/Vac (pKa)

5e-4

Tool Pressure (pKa)0

Voltage (V)0

Alarm (min)90

ActionN/A




Step 11

Top Temp (C)100

Bot Temp (C)100

Pressure/Vac (pKa)5e-4

Tool Pressure (pKa)0

Voltage (V)0

Alarm (min)90

ActionToolUp




Step 12

Top Temp (C)50

Bot Temp (C)50

Pressure/Vac (pKa)100

Tool Pressure (pKa)0

Voltage (V)0

Alarm (min)270

ActionN/A


Wire Bonding

K&S 4523A - Al Wedge Bonding

 Equipment
          EquipmentK&S 4523A Wedge Bonder

Manufacturer:Karl Suss

Model4523A SemiAuto

Wire MaterialAluminum

Wire Diameter25 um



 Substrate

Substrate Size 6" x 6" maximum

Wire Length 10 mm maximum

Pad Size 100 um minimum

Pad Spacing 50 um minumum



 Bonding Parametersa,b

Tail 8

Loop 6

Search 1 4

Power 1 7

Time 1 8

Force 1 5

Search 2 7

Power 2 8

Time 2 8

Force 2 5

Ball Size  6

Temperatureup to 130 C

a: The parameters well worked in the past

b: Optimized for bonding to ENIG plated FR4 200 um pads


K&S 4522 - Au Ball Bonding

 Equipment
          EquipmentK&S 4522 Ball Bonder

Manufacturer:Karl Suss

Model4522

Wire MaterialGold

Wire Diameter25 u



 Substrate

Substrate Size 6" x 6" maximum

Wire Length 10 mm maximum

Pad Size 100 um minimum

Pad Spacing 50 um minumum



 Bonding Parametersa,b

Tail 8

Loop 6

Search 1 4

Power 1 7

Time 1 8

Force 1 5

Search 2 7

Power 2 8

Time 2 8

Force 2 5

Ball Size  6

Temperatureup to 130 C

a: The parameters well worked in the past

b: Optimized for bonding to ENIG plated FR4 200 um pads


Flip Chip Bonding

FineTech - Sn/Pb Solder Bonding

 Equipment
          EquipmentFinetech Sub-micron Flip-Chip Bonder

ManufacturerFineTech

Model 



 Bonding Parametersa,b