Wafer Bonding
Step 1
Top Temp (C)
50
Bot Temp (C)
Pressure/Vac (kPa)
Tool Pressure (kPa)
Voltage (V)
Alarm (min)
Action
Step 2
Step 5
Pressure/Vac (pKa)
Wire Bonding
a: The parameters well worked in the past
b: Optimized for bonding to ENIG plated FR4 200 um pads
Flip Chip Bonding