IMS- Micro/Nano Fabrication Facility
Processing
Tystar Poly 4 - PolySilicon

Equipment
          EquipmentTystar Poly Furnace 4

Manufacturer: Tystar Inc.

Model Poly

Tube Size up to 6 in




Recipe

Recipe Name:

Low Stress PolySilicon


Gas  SiH4

Gas Flow Rate100 - 150 sccm

Pressure250 – 350 mTorr

Temperature580 – 620 C




Resultsa

Deposition Rate6 - 9 nm/min

Index of Refraction 3.5 – 5.5

Uniformity:< 3%b

Residual Stress50 – 100 Mpac




a: Date provided by Tystar Inc.

b: Calculated using 1σ std. Deviation

c: Gas Ratio Dependant