IMS- Micro/Nano Fabrication Facility
Processing
1. Recipe Library
2. Fabrication Fundamentals
3. Equipment Selection
3. IEN Process Search
3. Standard Operation Procedure
About Staff
Al Etching
Annealing
Au Etching
BLE Spinner
Cambridge NanoTech ALD (left) 
Cambridge NanoTech Plasma ALD - Right (non-metal)
Characterization based on Industry Standards
Chemical Dry Etch
Chemical Vapor Deposition (CVD)
Chemicals Inventory
Cr Etching
Cu Etching
Denton Infinity
Developers Provided
Development
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Direct Write
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Electroless Plating
Electroplating
Copper Plating
Gold Plating
Nickel Plating
Solder Plating
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K&S 4522 - Au Ball Bonding
K&S 4523A - Al Wedge Bonding
Karl Suss RC8 Spinner - Marcus
Karl Suss RC8 Spinner - Pettit
Laser MicroMachining Technologies
Laurel Spinner
LPCVD
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Materials
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Oxford ICP PECVD - Oxide
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Oxford PECVD Right - Standard Nitride Recipe
P / N Doping
Parker
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Plasma Etching
Plasma Therm PECVD - Standard Nitride Recipe
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Plasma Therm SLR RIE
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Polysilicon
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Processing Help
PVD75 Filament Evaporator
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Resists
SCS Spincoater Processing Tab
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Silicon Dioxide Etching
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STS AOE ICP
STS PECVD 2
STS PECVD 2 - Oxide
Suess AltaSpray Coater
Thermo Oxidation
Thin Film Materials
Titanium Etching
Tool Selection
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Tystar Poly Furnace 3
Unaxis PECVD
Vision RIE 1
Wet Bench Chemicals
Wet Etching
Wire Bonding
XeF2 Etching
Solder Plating
​
 Equipment
           EquipmentPlating Station

Substrate Sizeup to 6" wafer



 Plating Parametersa

Plating Solution Techni Solder Matte NF820 60/40

Anode Sn/Pb Anode

Anode to Cathode Ratio 1:1

Temperature 20 oC

Stirring Rate 500 rpm

Current Density  30 mA/cm2

Pulse Optional

a: The parameters are provide by Transene

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