IMS- Micro/Nano Fabrication Facility
Processing
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Al Etching
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BLE Spinner
Cambridge NanoTech ALD (left) 
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XeF2 Etching
Gold Plating
 Equipment
           EquipmentPlating Station

Substrate Sizeup to 6" wafer



 Plating Parametersa

Plating Solution Transene Sulfite Gold TSG-250

Anode Platinized

Anode to Cathode Ratio 1:1

Temperature 43 - 71 oC

pH 6.0 - 7.0

Stirring Rate 500 rpm

Current Density 0.01 - 0.08 mA/cm2

Pulse Optional

a: The parameters are provide by Transene

 


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