IMS- Micro/Nano Fabrication Facility
Processing
1. Recipe Library
2. Fabrication Fundamentals
3. Equipment Selection
3. IEN Process Search
3. Standard Operation Procedure
About Staff
Al Etching
Annealing
Au Etching
BLE Spinner
Cambridge NanoTech ALD (left) 
Cambridge NanoTech Plasma ALD - Right (non-metal)
Characterization based on Industry Standards
Chemical Dry Etch
Chemical Vapor Deposition (CVD)
Chemicals Inventory
Cr Etching
Cu Etching
Denton Infinity
Developers Provided
Development
Dicing
Direct Write
Dry Etching
Electroless Plating
Electroplating
Copper Plating
Gold Plating
Nickel Plating
Solder Plating
Flipchip Bonding
General Safety
Georgia Valve and Fitting
Incident Report
Instructional Lab Tools
K&S 4522 - Au Ball Bonding
K&S 4523A - Al Wedge Bonding
Karl Suss RC8 Spinner - Marcus
Karl Suss RC8 Spinner - Pettit
Laser MicroMachining Technologies
Laurel Spinner
LPCVD
Materials
Materials
Metal Deposition
Metal Etchants
New Laser Proposal
Other Developers
Oxford ICP PECVD - Oxide
Oxford PECVD
Oxford PECVD Left - Amorphous Silicon
Oxford PECVD Left - Carbide
Oxford PECVD Right - Oxide
Oxford PECVD Right - Standard Nitride Recipe
P / N Doping
Parker
Parylene
Plasma Etching
Plasma Therm PECVD - Standard Nitride Recipe
Plasma Therm PECVD - Standard Oxide Recipe
Plasma Therm SLR RIE
Polisher / Lapper
Polisher/Lapper
Polymer
Polymer Curing/Sintering
Polysilicon
Process Flow
Process Flow
Processing Help
PVD75 Filament Evaporator
Radiation Safety
Rapid Thermal Process
Recipe Library
Remote Processing
Research Capabilities
Resists
SCS Spincoater Processing Tab
SDS Database
Semiconductor
Silicon Dioxide Etching
Silicon Nitride Etching
STS AOE ICP
STS PECVD 2
STS PECVD 2 - Oxide
Suess AltaSpray Coater
Thermo Oxidation
Thin Film Materials
Titanium Etching
Tool Selection
Tutorials
Tystar Poly Furnace 3
Unaxis PECVD
Vision RIE 1
Wet Bench Chemicals
Wet Etching
Wire Bonding
XeF2 Etching
Copper Plating
 Equipment
           EquipmentPlating Station

Substrate Sizeup to 6" wafer



 Plating Parametersa

Plating Solution Transene Copper  Plating Acid Type

Anode Copper Board

Anode to Cathode Ratio 1:1

Temperature 21 - 49 oC

pH 2.5 - 3.5

Stirring Rate 500 rpm

Current Density 0.21 - 0.54 mA/cm2

Pulse Optional

a: The parameters are provide by Transene

 ​

Georgia Institute of Technology
Shared User Management System
791 Atlantic Drive
Atlanta GA 30332-0269 
© Georgia Institute of Technology