 | | | Equipment | | | Equipment | Plating Station |
| Substrate Size | up to 6" wafer |
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| | | Plating Parametersa |
| Plating Solution | Immersion Gold CF |
| Mix Ratio | 3535 ml Part A, 250 ml Part B |
| pH | 8.6 - 9.0 |
| Temperature | 70 - 75 oC |
| Substrate | Si, Ge, GaAs, Ni, CdS, Kovar |
| Deposition Rate | 25 nm/min on Ni 40 nm/min on Cu |
| Plating Thickness | 0.5 um Maximum |
| Agitation | Continuous Required |
| a: The parameters are provide by Transene |
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