The Georgia Tech Mini Tystar 2 is used for dry and wet oxidation at temperatures between 700-1100°C. Wet oxidation steam is created from the combustion of H2 and O2 (a pyrogenic process). Batches of 4” silicon wafers (up to 25 wafers) can be processed at the same time, and the oxide uniformity is typically less than 1%.

Common recipes:
WETOX.002
DRYOX.002
ANNEAL.002