Georgia Tech RIE (Reactive Ion Etching) is a dry-etching technology commonly used in microfabrication. The process uses a chemically reactive plasma that is generated under low pressure with a electromagnetic field. This plasma is used to remove materials deposited on substrates such as silicon wafers. Below are some of the RIE systems that the IEN houses.

Vision RIE F- chemistry based RIE process for dielectric etch	Unaxis RIE F- chemistry based RIE process for dielectric etch
Oxford EndPoint RIE F- chemistry based RIE process for dielectric etch	Plasma Therm SLR RIE Cl- chemistry based RIE process for metal etch