IEN - Micro/Nano Fabrication Facility
Georgia Tech RIE Landing Page

Georgia Tech RIE (Reactive Ion Etching) is a dry-etching technology commonly used in microfabrication. The process uses a chemically reactive plasma that is generated under low pressure with a electromagnetic field. This plasma is used to remove materials deposited on substrates such as silicon wafers. Below are some of the RIE systems that the IEN houses.

 

Advanced Vacuum RIE

F- chemistry based RIE process for dielectric etch

Unaxis RIE

F- chemistry based RIE process for dielectric etch

Oxford EndPoint RIE

F- chemistry based RIE process for dielectric etch

Plasma Therm SLR RIE

Cl- chemistry based RIE process for metal etch