Formerly the Advanced Vacuum Vision 320 RIE, the Georgia Tech CtrLayer RIE 2 showcases a revamped software set programmed by the IEN. It is a manually loaded Reactive Ion Etcher plasma system. It is used to etch dielectric materials and shallow silicon by using SF6 and CHF3 as an etching gas. The CtrLayer RIE 2 has a permanent graphite plate in order to reduce temperature build up during a long process run.

Materials etched and acceptable masks

• Etched: SiO2, Si3N4, Si, SiC
• Masks: metals and photoresist

Component specifications

• 600W 13.56MHz Seren power supply

Gases

• Ar, N2 , O2 , CHF3 , SF6 

Process Pressure

• 10-800mTorr

Substrate

• Small pieces – one 8” wafer

Temperature

• 5-40°C

Recent Service/Modification

• Vision 2 moved to Marcus Cleanroom
• Full electrode rebuild for both units
• Hoist rebuild for Vision 2
• Power supply service both units