IMS- Micro/Nano Fabrication Facility
2.5 DRIE/ICP Etching Capabilities

 

 

Silicon - Bosch Etch

 

III/V and Shallow Silicon - Cl/HBr-based Etch

 

   

Thick Dielectric DRIE Etching

(Glass, Quartz, SiC, Diamond, etc.)

General Purpose DRIE Etching

(All materials including metals)

 

Contact Information
For process support please click below