IMS- Micro/Nano Fabrication Facility
2.2 ICP Equipment

Georgia Tech ICP (Induced Coupled Plasma) Etching is a frequently used etch technology in semiconductor fabrication. ​​ ICP systems generate a high density plasma which allow for high etch rates as well as high etch uniformity.

Commonly used for etching Gallium Nitride, Silicon structures, as well as Tungsten.

 

Plasma Therm ICP

F-, Cl- chemistry based non-Bosch process

Plasma Therm Versaline ICP (SiC Etching)

Bosch process for SiC etch only

STS Pegasus ICP

Bosch process for Si etch only

Plasma Therm Versaline ICP (Dielectric Etch)

Bosch process

 

Contact Information
For process support please click below