The Georgia Tech CHA 2 E-beam evaporator will provide very little coating to the sides of any features that are perpendicular to the surface of the substrate (anisotropic). -Used to deposit metals -Low Process Pressure

Function

• E-beam Evaporation System for Metals

Materials Deposited

• Ti, Cr, Ni, Au, Al, Cu, Ag

Component Specifications

• 25cc 6 pocket crucibles.
• Sample holder holds up to three 4” wafers.

Substrate Size

• Up to 4” wafer

Process Pressure

• 5x10-6Torr – 5x10-7Torr

Vendor Specified Capabilities

• 6 Pocket E-beam Evaporation system.
• Sample rotation.
• Crystal sensor deposition monitoring system.
• Cryopump vacuum system.