The Georgia Tech Unifilm Multisource Sputtering System deposits thin metal films in a argon-enriched low vacuum. The Unifilm Sputterer has a deposition monitor to quickly and accurately measure Source distributions, a computer-controlled Planetary System, and a computer model of the source-planetary system. -Process wafers up to 4" -Deposition Processes: Aluminum, Aluminum/Silicon, Gold, Titanium, Copper, Chromium, Molybdenum, Molybdenum/Copper, Nickel, Silicon, Tantalum -DC/RF power