IEN - Micro/Nano Fabrication Facility
Xactix Xenon Difluoride Etcher
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Equipment Description

The Georgia Tech Xactix Xenon Difluoride Etcher uses xenon difluoride gas sent through a showerhead to isotropically dry etch silicon, germanium, and molybdenum. It can process pieces up to 4" wafers and generates relatively rough isotropically etched features.

Vendor-specified system features

  • Excellent selectivity SiO2 :Si (1000:1), good selectivity to PR
  • Potential to etch very small devices (30nm)
  • Etch does not attack Bosch passivation layer – can switch between tools and still protect trench walls

Materials etched

  • Si, poly-Si

Acceptable masks

  • PR, SiO2 , Si3N4

Gases

  • XeF2

Substrate

  • 1 die - 150mm wafer (specialized chuck)
Institute Georgia Tech
Department IEN - Micro/Nano Fabrication Facility
Sub Tool Of
Marcus Inorganic Cleanroom