The thin film deposition basics section gives users an overview of different deposition techniques commonly available in the IEN cleanrooms. A list of equipment associated with these techniques is also provided. Chemical vapor deposition processes are generally used to deposit dielectric films. Physical vapor deposition processes are generally used to deposit metals and some dielectrics. Atomic layer deposition films are used to deposit high quality thin film (< 100nm) dielectrics and metals. Click on the links below to learn more about the selected topic.