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IMS- Micro/Nano Fabrication Facility
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Processing
1. New User Preparation
2. Processing Basics
2.1 Photolithography
2.2 Thin Film Deposition
2.3 Plasma Etching
2.4 Thermal Processing
2.5 Metrology
2.6 Packaging
2.7 Technical Seminars
3. Recipe Library
4. Processing Procedure
5. Process/Equipment Selection
6. Processing Materials
7. Equipment Baseline
8. Processing Safety
9. Request Help
A. System Contamination Control Policy
2.6 Packaging
Packaging Equipment Overview
Packaging Fundamentals
Related Links
ADT 7100 Dicing Saw
EVG520 Wafer Bonder
Finetech Flip-chip Bonder
K&S 4522 Ball Bonder
Logitech LP50 Lapper
Logitech PM5 Polisher
SCS Parylene Coater
Contact Information
The Institute for Electronics and Nanotechnology at Georgia Tech
345 Ferst Drive, Atlanta GA, 30332
For process support please click below
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