7. Equipment Baseline

This section contains the baseline test reports for the instruments related to photolithography, thin film deposition equipment, plasma etching equipment, and for thermal furnaces. The baseline testing for these instruments are conducted once in every quarter of the year. Earlier baseline reports can be found in this "**Archives**"link.

**BASELINE REPORTS**
Photolithography	Thin Films	Plasma Etching	Thermal Furnaces
Mask Less Aligners	CVD	Bosch process	Tystar Nitride Furnaces
Heidelberg MLA150 #1	STS PECVD 3 (SiO₂, SiN_x)	STS ICP (Si)	Nitride #3 (Dry Ox)
Heidelberg MLA150 #2	Oxford ICP PECVD (SiO₂, SiN_x)	STS Pegasus ICP (Si)	Nitride #4 (SiN, LSiN)
	Unaxis PECVD (SiO₂)	STS HRM ICP (Si)

Karl Suss Mask Aligners	PVD	Dielectric Etch	Tystar Poly Furnaces
Karl SUSS MA6-Pettit (TSA/BSA)	Denton Disco Sputterer (TiN)	Unaxis 790 Series RIE (SiO₂)	Poly #2 (Dry Ox)
Karl SUSS MA6-Marcus (TSA)	PVD75 RF Sputterer (Ti)	Vision RIE 1 (SiO₂)	Ploy #3 (Poly Si)
SUSS MA8 TSA/BSA		Vision RIE 2 (SiO₂)	Poly #4 (Poly Si)
Spin Coaters	ALD	Oxford End-Point RIE (SiO₂)
SCS G3P8 3	Cambridge ALD	Plasma Therm RIE (SiO₂)
(SC 1813, SPR 220, NR9 1500)	Oxide Chamber (SiO₂)	Plasma Therm ICP Single Chamber (SiO₂)	Mini Tystar Furnaces
K&S RC8 Spinner	Metal Chamber (HfO₂)	Plasma Therm ICP (SiO₂)	Mini #1 (Wet Ox, Dry Ox)
	CtrLayer ALD 1 (Al₂O₃)		Mini #2 (Wet Ox, Dry Ox)
	CtrLayer ALD 2 (Al₂O₃)		Mini #3 (TEOS)

Contact Information

The Institute for Electronics and Nanotechnology at Georgia Tech
345 Ferst Drive, Atlanta GA, 30332

For process support please click below

BASELINE REPORTS