This section contains the standard Silicon and SOI etch recipes for all GT RIE and ICP equipment: STS ICP, STS HRM ICP, Plasma Therm ICP, and Plasma Therm RIE

STS ICP

• Location: Pettit Cleanroom
• Etching Capabilities:
  • Silicon Etch
  • SOI
  • Silicon Blanket Etch
• Sample size:
  • Pieces to 4” wafer. Pieces have to be placed on a four inch SiO2/Si wafer with cool grease, or with a kapton tape.
• Standard Recipes:

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STS HRM ICP

• Location: Marcus Cleanroom
• Etching Capabilities:
  • Silicon Etch
  • Smooth Side Wall Etch for Silicon
  • Silicon Blanket Etch
• Sample size:
  • Pieces to 4” wafer. Pieces have to be placed on a four inch SiO2/Si wafer with cool grease, or with a kapton tape.
• Standard Recipes:

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Plasma Therm ICP (Right Chamber)

• Location: Pettit Cleanroom
• Etching Capabilities:
  • Silicon Etch
• Sample size:
  • Pieces to 4” wafer. Pieces have to be placed on a four inch SiO2/Si wafer with cool grease, or with a kapton tape.
• Standard Recipes:

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