This section contains the standard descum etch recipes for all GT RIE equipment: CTRLayer RIE 2, CTRLyaer RIE 1, Plasma Therm RIE (Right Chamber)

CTRLayer RIE 2

• Location: Marcus Cleanroom
• Etching Capabilities:
  • Silicon Dioxide
  • Descum
• Sample size:
  • Pieces to 8” wafer
  • Up to four, 4” wafers or a single 6” wafer at one time
• Standard Recipes:

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CTRLayer RIE 1

• Location: Marcus Cleanroom
• Etching Capabilities:
  • Silicon Dioxide
  • Descum
• Sample size:
  • Pieces to 8” wafer
  • Up to four, 4” wafers or a single 6” wafer at one time
• Standard Recipes:

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Plasma Therm RIE (Right Chamber)

• Location: Petitt  Cleanroom
• Etching Capabilities:
  • Silicon Dioxide
  • Descum
• Sample size:
  • Pieces to 4” wafer
  • Up to four, 4” wafers at a time
• Standard Recipes:

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