IEN- Micro/Nano Fabrication Facility
3.7 Descum

This section contains the standard descum etch recipes for all GT RIE equipment: Vision RIE 2, Vision RIE 1, Plasma Therm RIE (Right Chamber)

Vision RIE 2

  • Location: Marcus Cleanroom
  • Etching Capabilities:
    • Silicon Dioxide
    • Descum
  • Sample size:
    • Pieces to 8” wafer
    • Up to four, 4” wafers or a single 6” wafer at one time
  • Standard Recipes:

RIE 2 Descum

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Vision RIE 1

  • Location: Marcus Cleanroom
  • Etching Capabilities:
    • Silicon Dioxide
    • Descum
  • Sample size:
    • Pieces to 8” wafer
    • Up to four, 4” wafers or a single 6” wafer at one time
  • Standard Recipes:

 

RIE 1 Descum

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Plasma Therm RIE (Right Chamber)

  • Location: Petitt  Cleanroom
  • Etching Capabilities:
    • Silicon Dioxide
    • Descum
  • Sample size:
    • Pieces to 4” wafer
    • Up to four, 4” wafers at a time
  • Standard Recipes:

Plasma Therm RIE Descum

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Contact Information
The Institute for Electronics and Nanotechnology at Georgia Tech
345 Ferst Drive, Atlanta GA, 30332

For process support please click below