The Georgia Tech STS PECVD 3 is a Plasma-Enhanced Chemical Vapor Deposition (PECVD) equipment for deposition of high quality semiconductor and dielectric thin films.
Specification:
- SiO2, Si3N4, a-Si
- 4", 6" wafer only
- Loadlock with 2 wafer carousal
- P+/N- doping gases available
- Both low/high frequency RF power available