IEN - Micro/Nano Fabrication Facility
YES-R1 Plasma Cleaner
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Equipment Description

The Georgia Tech Plasma Cleaner uses an active ionized gas (plasma) in a low pressure environment to descum and remove residual organics and thin oxides from samples. -typical chamber temperature 25C-80C (heat from plasma) -little to no turbulence -Ar or O2 gas -sample size can vary from small pieces to 12inx12inx4in.

Functions

  • Descum and remove residual organics and thin oxides
  • Controlled through MicroLogix PLC upgrade

Gases

  • O2 , Ar, N2

Process Pressure

  • 1500mTorr

Substrate

  • size varies upon user request

Temperatures

  • 25-80˚C

 

Institute Georgia Tech
Department IEN - Micro/Nano Fabrication Facility
Sub Tool Of
Marcus Inorganic Cleanroom
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