IMS- Micro/Nano Fabrication Facility
3.3.1 Metal Deposition

This section contains the standard metal physical vapor deposition (PVD) recipes/available tools/metals for all GT IEN equipment: Sputtering, Evaporation, and Electro- and Electro-less plating.

 

Sputtering

Conformal Deposition

Marcus Inorganic Cleanroom

Denton Discovery

  • Metals Available: Aluminum, Chromium, Copper, Iron, Nickel, Palladium, Silver, Tantalum, Titanium, and Tungsten
  • Sample size: pieces to 6” wafers
    • Up to three, 4” wafers or one, 6” wafer at one time

Denton Discovery Ti Dep Recipe

PVD 75 RF Sputterer

  • Metals Available: Titanium, Copper, Aluminium.
  • Platen size: 12 inch
    • Substrates of various size can be mounted on the platen.

PVD 75 Ti dep Recipe

Unifilm Sputterer

  • Metals Available: Aluminum, Chromium, Copper, Gold, Nickel, Platinum, Silver, Tantalum, Titanium, and Tungsten
  • Sample size: pieces to 4” wafer
    • Up to one, 4” wafer at one time

CVC DC Sputterer

  • Metals Available: Aluminum, Chromium, Copper, Iron, Nickel, Palladium, Silver, Tantalum, Titanium, and Tungsten
  • Sample size: pieces to 6” wafer
    • Up to six, 6” wafers at one time

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Evaporation

Directional Deposition

Marcus Inorganic Cleanroom

CHA E-Beam 2

  • Metals Available: Aluminum, Chromium Copper, Gold, Iron, Nickel, Silver, Tin, and Titanium, Silicon
  • Sample size: pieces to 4” wafers
    • Up to three, 4” wafers at one time

Cha 2 Deposition

Denton Explorer

  • Metals Available: Aluminum, Chromium, Copper, Gold, Iron, Nickel, Platinum, Silver, Tin, and Titanium
  • Sample size: pieces to 4” wafers
    • Up to three, 4” wafers at one time

Denton Explorer Deposition

PVD 75 Filament Evaporator

  • Metals Available: Aluminum, Chromium, Copper, Nickel, Silver
  • Platen size: 12 inch
    • Substrates of various size can be mounted on the platen.

CVC E-beam Evaporator

  • Metals Available: Aluminum, Chromium, Copper, Gold, Iron, Nickel, Silver, Tin, and Titanium
  • Sample size: Pieces up to 6” wafer

Denton Infinity - E-beam/Filament Evaporator

  • Metals Available: Copper, Platinum, Nickel, Chromium and Titanium
  • Sample size: Pieces up to 4” wafer

Marcus Biocleanroom

Lesker E-beam Evaporator – Soft Lithography

  • Metals Available: Copper, Gold, Nickel and Titanium
  • Sample size: Pieces up to 4” wafer

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Electro- and Electro-less plating

  • Metals Allowed for Electroplating
    • Cu, Ni, Sn-Pd Solder, and Au (with special approval)
  • Metals Allowed for Electro-less plating
    • Ni and Au
  • Contact Staff for approval of different materials

*Plating supplies are not supplied by the cleanroom. A fumehood in the Marcus Inoorganic cleanroom is dedicated to plating and is equipped with four power supplies.

 

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Contact Information
The Institute for Electronics and Nanotechnology at Georgia Tech
345 Ferst Drive, Atlanta GA, 30332

For process support please click below