This section contains the standard metal physical vapor deposition (PVD) recipes/available tools/metals for all GT IEN equipment: Sputtering, Evaporation, and Electro- and Electro-less plating.
Sputtering
Conformal Deposition
Marcus Inorganic Cleanroom
Denton Discovery
- Metals Available: Aluminum, Chromium, Copper, Iron, Nickel, Palladium, Silver, Tantalum, Titanium, and Tungsten
- Sample size: pieces to 6” wafers
- Up to three, 4” wafers or one, 6” wafer at one time
PVD 75 RF Sputterer
- Metals Available: Titanium, Copper, Aluminium.
- Platen size: 12 inch
- Substrates of various size can be mounted on the platen.
Unifilm Sputterer
- Metals Available: Aluminum, Chromium, Copper, Gold, Nickel, Platinum, Silver, Tantalum, Titanium, and Tungsten
- Sample size: pieces to 4” wafer
- Up to one, 4” wafer at one time
CVC DC Sputterer
- Metals Available: Aluminum, Chromium, Copper, Iron, Nickel, Palladium, Silver, Tantalum, Titanium, and Tungsten
- Sample size: pieces to 6” wafer
- Up to six, 6” wafers at one time
(Back to Top)
Evaporation
Directional Deposition
Marcus Inorganic Cleanroom
CHA E-Beam 2
- Metals Available: Aluminum, Chromium Copper, Gold, Iron, Nickel, Silver, Tin, and Titanium, Silicon
- Sample size: pieces to 4” wafers
- Up to three, 4” wafers at one time
Denton Explorer
- Metals Available: Aluminum, Chromium, Copper, Gold, Iron, Nickel, Platinum, Silver, Tin, and Titanium
- Sample size: pieces to 4” wafers
- Up to three, 4” wafers at one time
PVD 75 Filament Evaporator
- Metals Available: Aluminum, Chromium, Copper, Nickel, Silver
- Platen size: 12 inch
- Substrates of various size can be mounted on the platen.
CVC E-beam Evaporator
- Metals Available: Aluminum, Chromium, Copper, Gold, Iron, Nickel, Silver, Tin, and Titanium
- Sample size: Pieces up to 6” wafer
Denton Infinity - E-beam/Filament Evaporator
- Metals Available: Copper, Platinum, Nickel, Chromium and Titanium
- Sample size: Pieces up to 4” wafer
Marcus Biocleanroom
Lesker E-beam Evaporator – Soft Lithography
- Metals Available: Copper, Gold, Nickel and Titanium
- Sample size: Pieces up to 4” wafer
(Back to Top)
Electro- and Electro-less plating
- Metals Allowed for Electroplating
- Cu, Ni, Sn-Pd Solder, and Au (with special approval)
- Metals Allowed for Electro-less plating
- Contact Staff for approval of different materials
*Plating supplies are not supplied by the cleanroom. A fumehood in the Marcus Inoorganic cleanroom is dedicated to plating and is equipped with four power supplies.
(Back to Top)