This section contains the standard dielectric physical vapor deposition (PVD) recipes/available tools/materials for all GT IEN equipment: Sputtering, Evaporation.

Sputtering

Conformal Deposition

Denton Discovery (Marcus Inorganic)

• Dielectrics Available:
  • ITO
  • Silicon Dioxide
  • Aluminum Oxide
  • TiN_x
• Sample size: pieces to 6” wafers
  • Up to three, 4” wafers or one, 6” wafer at one time

AJA Nitride Sputterer (Marcus Inorganic)

• Dielectrics Available:
  • Aluminum Nitride
  • Titanium Nitride
  • Tantalum Nitride
• Allows for reactive sputtering
• Sample Size: pieces up to 4” wafer

PVD RF (Marcus Inorganic)

• Dielectrics Available
  • Zinc Oxide
  • Aluminum Oxide
  • Silicon Dioxide
  • ITO
• Platen size: 12 inch
  • Substrates of various size can be mounted on the platen.

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Evaporation

Directional Deposition

CHA E-beam 1 (Marcus Inorganic)

• Dielectrics Available:
  • Silicon Dioxide
  • Aluminum Oxide
  • Titanium Oxide
• Sample size: pieces to 4” wafers
  • Up to three, 4” wafers at one time

CtrLayer Anti-Reflective Coater (Marcus Inorganic)

• Dielectrics Available:
  • Zinc Sulfide
  • Magnesium Fluoride
• Sample size: pieces to 4” wafers

Denton Explorer (Marcus Inorganic)

• Dielectrics Available:
  • Silicon Dioxide
  • Aluminum Oxide
• Sample size: pieces to 4” wafers
  • Up to three,4” wafers at one time

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