IEN - Micro/Nano Fabrication Facility
Georgia Tech - OPTEC Femtosecond Laser
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Equipment Description

The Georgia Tech Optec Femtosecond laser is an OPTEC WS-Flex USP system that uses a femtosecond laser to process practically any material through ultra-short laser pulses photo-ablation. The ultra-short laser pulse is effective on polymers, metal, ceramics, glass, single crystals, and polymorphic crystals. Materials are ionized by the laser pulse and removed from the surface in a plasma cloud, leaving a clean surface at the interaction site. Contrary to typical thermal laser operations, the femtosecond laser is not as sensitive to wavelength absorption and therefore offers minimum thermal, creating a no heat-affected zone on the part.

Applications include:

    Cutting
    Milling
    Drilling
    Tube processing
    Composite material cutting
    Scribing
    Surface structuring

 

System specifications are: 

    1030nm Wavelength (nm)
    Machining head: Galvo scanner, fixed lens, cutting head, and      Infinite Field of View (IFOV)
    Laser type (pulse duration): picosecond, femtosecond
    Max. Scanner field: 20x20 mm
    Minimum Spot size: 6 µm for fixed head, 14µm for galvo head
    XY stages travel: 300x300 mm
    Submicron stages resolution
    Class 1 laser system (fully interlocked)

 

Institute Georgia Tech
Department IEN - Micro/Nano Fabrication Facility
System Specifications     1030nm Wavelength (nm)
    Machining head: Galvo scanner, fixed lens, cutting head, and Infinite Field of View (IFOV)
    Laser type (pulse duration): picosecond, femtosecond
    Max. Scanner field: 20x20 mm
    Minimum Spot size: 6 µm for fixed head, 14µm for galvo head
    XY stages travel: 300x300 mm
    Submicron stages resolution
    Class 1 laser system (fully interlocked)
Applications     Cutting
    Milling
    Drilling
    Tube processing
    Composite material cutting
    Scribing
    Surface structuring
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