The Georgia Tech IEN Alabama UV laser is a 355nm laser designed to work on silicon wafers for the photovoltaic industry. It has a 70um spot size and a 200mm X 200mm scanning area with high-speed scanning up to 1000mm/second. The 355nm UV laser can be used for µ-via drilling, Glass Cutting & Drilling, Thin-film Scribing, Ceramic Processing, Flex PCB drilling & cutting, IC Package singulation, Silicon Wafer scribing and cutting, and fine metal machining. It can be used on silicon wafers, glass, polymers, and thin metals.