IEN - Micro/Nano Fabrication Facility
SSI RTP
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Equipment Description

The Georgia Tech SSI RTP system is a rapid temperature processing system for up to 4" wafers. Specs: -max. allowable temp: 900C (contact staff for 901C-1100C) -N2 / Air / O2 available -10 SLM (10,000 sccm) range MFCs -up to 80C/s ramp rate

Institute Georgia Tech
Department IEN - Micro/Nano Fabrication Facility
Sub Tool Of
Marcus Inorganic Cleanroom
System Specifications Substrates size up to 4" wafers.

Max. allowable temp: 900C (contact staff for 901C-1100C)

Temperature ramp rate up to 80C/s
 
Process Gas - N2 / Air / O2

Gas Flow Range up to 10 SLM
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