Annealing / Sintering Tystar Furnace
N-Type Dopant
P-Type Dopant
Standard Silicon Oxide
High-Frequency Silicon Oxide
Low-Frequency Silicon Oxide
Standard Nitride
High-Frequency Silicon Nitride
Low Frequency Silicon Nitride
Low Stress Silicon Nitride
Silicon Oxynitride
Silicon Carbide
Diamond-Like Carbon
Poly-Silicon
Semi Insulating Polycrystalline Silicon
Thermal Oxide Low Temp
Thermal Oxide High Temp
Wet Oxidations
Standard Thermal Nitride
Low Stress Thermal Nitride
Silicon Nitride Plasma-Therm ICP
Silicon Nitride Plasma-Therm RIE High Rate
Silicon Nitride Plasma-Therm RIE Selective to Si
Silicon Nitride Plasma-Therm RIE Passivation Removal
Silicon Oxide Plasma-Therm ICP Standard
Silicon Oxide Plasma-Therm ICP High Selectivity
Silicon Oxide Plasma-Therm RIE
Gallium Nitride Plasma-Therm ICP
Indium Phosphide Plasma-Therm RIE
Zinc Sulfide Plasma-Therm RIE
Al Plasma Therm RIE
Cr Plasma Therm ICP
Cr Plasma Therm RIE
Polyimide Isotropic Plasma Therm RIE
Polyimide Anistropic Plasma Therm RIE
Photoresist Plasma Therm RIE
Ashing Dry Resist Stripping O2 Plasma
Gallium Arsenide Plasma-Therm RIE - Feature Etch
Gallium Arsenide Plasma-Therm RIE - Via Hole Etch
Si Plasma Therm RIE Trench Etch - Fluorine
Si Plasma Therm RIE Trench Etch - Chlorine
Si STS ICP Module 1: 2µm wide, 60µm depth bulk Si etch
Si STS ICP Module 2: 1µm wide, 10µm depth SOI etch
Si STS ICP Module 3: 5µm wide, 10µm depth SOI etch