The Georgia Tech Karl Suss TSA MA6 Mask Aligner offers high quality exposure optics for high resolution and optimum edge quality with 0.2 micron top alignment resolution. This mask aligner offers accurate and precise gap settings for high yield and contains high intensity light sources that reduce process time. It is optimized for top size alignment (TSA) and is capable of processing up to 6"/150mm wafers. The components consist of UV250 optics and monitor and Olympus 5x, 10x, and 20x objectives lenses.