Purpose: To remove resist residual from substrate surface.

Location: Pettit and Marcus Inorganic Cleanrooms

Tools: Plasma Therm RIE, Vision RIE, Oxford End-point RIE, Unaxis RIE

Setup Procedures:

1. Make sure the backside of your sample is clean.
2. Edit the standard descum recipe on the tool. A typical time for descum process is 30-60 seconds.

Number of substrates: up to four, 4” wafers

Process Procedures:

1. Vent the process chamber and open the lid.
2. Place your sample in the process chamber.
3. Run the recipe.
4. Take note of the process parameters during the etch step (1 min or less).
5. Remove your sample from the chamber and pump down the chamber
6. Run the standard cleaning recipe.

Time:  approximately 15 minutes

Comments:

• Descum is only allowed to be run for up to one minute.

Verification:

• Particle level: can be observed under microscope with dark field, or measured accurately with Surfscan
• Hydrophobicity: can be measured with contact angle measurement tool