Equipment Description
The Unifilm Multisource Sputtering System deposits thin metal films in a argon-enriched low vacuum. The Unifilm Sputterer has a deposition monitor to quickly and accurately measure Source distributions, a computer-controlled Planetary System, and a computer model of the source-planetary system. -Process wafers up to 4" -Deposition Processes: Aluminum, Aluminum/Silicon, Gold, Titanium, Copper, Chromium, Molybdenum, Molybdenum/Copper, Nickel, Silicon, Tantalum -DC/RF power
Standard Materials Available: Aluminum, Aluminum/Silicon, Gold, Titanium, Copper, Chromium, Molybdenum, Molybdenum/Copper, Nickel, Silicon, Tantalum, and other materials as approved by staff.
Manufacturer: Unifilm
| Institute |
Georgia Tech |
| Department |
IEN - Micro/Nano Fabrication Facility |
Sub Tool Of  |
Marcus Inorganic Cleanroom |
| |
Machine Specifications and Data:
Machine Specifications:
- Process wafers up to 4", glass slides, and small pieces
- DC power
- Make sure that you turn on water flow before running your recipe to prevent overheating the equipment!
Power Specifications:
- RF/DC power
- Miscellaneous note
- Maximum Current for DC Sputtering:
- Maximum Power for RF Sputtering:
- Maximum Temperature for Substrate Heater: