IMS- Micro/Nano Fabrication Facility
Denton Explorer - E-beam Evaporator
Equipment Description

A close up of a machineDescription automatically generatedThe Denton Explorer is a six pocket e-beam evaporator system used to coat samples with various metals. A high-intensity beam of electrons is focused on the center of a crucible containing the material to be evaporated. In a typical process, the chamber is pumped down to a pressure of 3e-6 Torr to increase the mean free path. The mean free path of a gas molecule is the average distance the molecule travels before it collides with another molecule. This prevents air molecules from interrupting metal atoms as they travel from the evaporation source to the substrate. Then, the metal is heated to the point of vaporization by a high-intensity beam of electrons. This causes the metal to evaporate, and the metal molecules travel in a straight line to be deposited on the substrate. Typical deposition rates range from 0.5 to five angstroms per second.  Endpoint detection is implemented through the Inficon XTC/2 quartz crystal rate controller interfaced to a programmable logic controller. New users will initially be limited to 3 angstroms per second for the maximum rate. Unlike sputtered films, evaporators only coat the surface facing the source. E-beam evaporators will provide very little coating to the sides of any features that are perpendicular to the surface of the substrate.

Capable of evaporating: Ti, Cr, Au, Pt, Ni, Fe, Ag, Al, Cu, Mo, SiO2, Al2O3

Features:
* Computer-controlled deposition
* Better than 3 x 10-6 Torr base pressure
* 0.5 - 5A/sec deposition rates
* Quartz crystal sensor deposition rate control
* 6-pocket source for Ti, Cr, Ni, Fe, Al, Cu, Pt, Au, SiO2, Al2O3

Manufacturer: Denton

Model Number: Explorer 14

   Room Number: 1279  

   Radiation Safety Required: Yes

Institute Georgia Tech
Department IEN - Micro/Nano Fabrication Facility
Sub Tool Of
Marcus Inorganic Cleanroom
 

 

Machine Specifications and Data

Machine Specifications:

  • Standard Materials Available: Ti, Cr, Au, Pt, Ni, Fe, Ag, Al, Cu, Mo, SiO2, Al2O3
  • Approved Substrates: Si, Glass, Pyrex, Quartz
  • Can Hold 6 different sources
  • Utilizes Ar Gas for Ion Assisted Deposition

Metallization Calibration Data: (Updated Jan 2020)

  Z-Ratio

Tooling Factor

Ti 0.628 208
Cr 0.305 250
Ni 0.331 204
Fe 0.349 168.8
Al 1.08 150
Au 0.381 183.48
Cu 0.37 164
Ag    
Pt 0.245 170
SiO2 1 208
Al2O3 0.336 378
Bi 0.637 150