CHA E-Beam Evaporator 2 (metals)

Equipment Description

A close up of a machineDescription automatically generated

The electron beam CHA Modified Mark-40 E-beam 2 evaporator is used to coat samples with various metals. A high-intensity beam of electrons is focused on the center of a crucible containing the material to be evaporated. The energy from the electron beam melts a region of the source metal. Material evaporates from the source and covers the sample with a thin layer.

Unlike sputtered films, evaporators only coat the surface facing away from the substrate. E-beam evaporators will provide very little coating to the sides of any features that are perpendicular to the surface of the substrate. In a typical process, the chamber is pumped down to a pressure of 5 x 10 -7 Torr. Typical deposition rates range from two to five angstroms per second. Typical thickness ranges from 10s of nanometers up to a micron.

Capable of evaporating: Titanium (Ti), Chrome (Cr), Gold (Au) , Nickel (Ni), Aluminum (Al), Copper (Cu) , Iron (Fe), Silver (Ag), Palladium (Pd), Other metals*

Manufacturer: CHA Industries

Model Number: Mark 40

Room Number: 1279

Radiation Safety Required: Yes

Institute	Georgia Tech
Department	IEN - Micro/Nano Fabrication Facility
Sub Tool Of	Marcus Inorganic Cleanroom

System Components and Data

System Components: Ion gauge, valve controller, IC5/Deposition controller, crucible selector, power supply controller, XY sweep, shutter and hoist control

Specifications:

Sample size based on sample holder -
- Flat Plate: Pieces to 12"
- 4" specific holder - holds three 4" wafers at a time
- 2" specific holder- up to 20 samples (dome shape)

Miscellaneous: The E-beam system holds six separate evaporation sources, allowing for evaporation of multiple materials in a single run. It has the capability to process a variety of sample sizes ranging from less than 1 cm² to 4" wafers. It uses a cryo-pump for rapid pump down. Electron beam power is automatically controlled for uniform evaporation with little operator work. The E-beam system can process up to 20 3" (or less) samples simultaneously using a multiple-sample dome wafer holder

Metallization Calibration Data: (Updated Jan 2020)

	Z-Ratio	Tooling Factor
Ti	0.628	168.0
Cr	0.305	231.7
Ni	0.331	176.1
Fe	0.349	100.0
Au	0.381	166.4
Al	1.080	156.3
Cu	0.437	150.0
Ag	0.529	180.0

Information

Schedule

Training

Equipment Description

The Georgia Tech CHA 2 E-beam evaporator will provide very little coating to the sides of any features that are perpendicular to the surface of the substrate (anisotropic). -Used to deposit metals -Low Process Pressure

Function

E-beam Evaporation System for Metals

Materials Deposited

Ti, Cr, Ni, Au, Al, Cu, Ag

Component Specifications

25cc 6 pocket crucibles.
Sample holder holds up to three 4” wafers.

Substrate Size

Up to 4” wafer

Process Pressure

5x10-6Torr – 5x10-7Torr

Vendor Specified Capabilities

6 Pocket E-beam Evaporation system.
Sample rotation.
Crystal sensor deposition monitoring system.
Cryopump vacuum system.

Institute	Georgia Tech
Department	IMS- Micro/Nano Fabrication Facility
Sub Tool Of	Marcus Inorganic Cleanroom

Contact Information