IMS- Micro/Nano Fabrication Facility
CVC DC Sputterer
Equipment Description

A close up of a machineDescription automatically generated

The DC sputterer is used to coat samples with metals. Metal coatings are usually performed with this sputterer or with the CVC E-Beam evaporator. Dielectric materials must be sputtered with the RF sputterer or deposited some other way, such as chemical vapor deposition (CVD) using a machine such as a PECVD. Sputterer depositions tend to coat all exposed surfaces, while evaporator depositions will coat surfaces facing the evaporation source, but will not coat the sides of features that are facing in directions parallel to the substrate surface.

The DC sputterer can be used to deposit virtually any metal. We have sputter targets for aluminum, copper, titanium, chrome, gold, platinum, nickel-chrome, and other materials. Sputter coatings are performed by accelerating argon ions into the surface of a sputter target, which is made of the material to be applied to the sample. The argon ions cause atoms to be knocked off of the target and deposited on the sample being coated.

Standard Metal Materials Availalable: Al, Cu, Ti, Cr, Au, Pt, NiCr

 

 

 

 

 

 

 

 

 

 

 

Institute Georgia Tech
Department IEN - Micro/Nano Fabrication Facility
Sub Tool Of
Marcus Inorganic Cleanroom
 

 

Machine Specifications and Data:

Machine Specifications:

  • Batch type deposition system
  • 6" copper, titanium, or aluminum targets for rapid sputtering
  • Two user exchangeable 3" targets for sputtering of many different materials.

Power Specifications:

  • DC Power Supply
  • Miscellaneous note
  • Maximum Current for DC Sputtering: 
  • Maximum Power for RF Sputtering: 
  • Maximum Temperature for Substrate Heater: 

System Components:

Electronic Stack:

  • The touch-screen monitor, which is used to control the machine and run recipes.
  • The lid hoist used for lifting and lowering the chamber lid.
  • A power supply for the sputtering guns.

Machine housing:

  • Sputterer lid - in the lid are four deposition stations
  • Station 2 - 6" target
  • Stations 3 and 4 - 3" targets
  • Sputterer chamber base
  • Lid hoist - for raising and lowering the lid
  • Rotostrate - rotating substrate holder with six sample holder trays - each can hold 1 150mm wafer or smaller