The filament evaporator is used to coat samples with various metals. The filament evaporator is ordinarily used for gold, nickel, chromium, aluminum, and copper coatings.  In a typical process the chamber is pumped down to a pressure of 5 x 10^-7 torr to prevent air molecules from interrupting metal atoms as they travel from the evaporation source to the substrate. Then the metal evaporation source is heated to a high temperature by a tungsten filament. This causes the metal to evaporate and be deposited on the substrate. Typical deposition rates range from 2 to 5 A/second. The filament evaporator is a good choice for samples that need to be evaporator coated (to avoid coating the sides of rough topologies) but are sensitive to x-ray radiation from the E-beam.

Capable of evaporating: Titanium (Ti), Chrome (Cr), Gold (Au), Nickel (Ni), Aluminum (Al), Copper (Cu), Iron (Fe), Silver (Ag), Tungsten (W), Palladium (Pd), Germanium (Ge), Vanadium (V), Nichrome (NiCr), Niobium (Nb), Bismuth (Bi), Other metals*

Manufacturer: Kurt J Lesker

Model Number: PVD 75

Room Number: 1279

Institute	Georgia Tech
Department	IEN - Micro/Nano Fabrication Facility
Sub Tool Of	Marcus Inorganic Cleanroon