Equipment Description
The Denton Discovery RF/DC Sputterer is configured for thin film deposition of up to 4 materials sequentially without breaking vacuum. The system is equipped with two 3" DC target positions and two 3” RF targets. Target #3 is dual power and can run either DC or RF power.
Standard Metal Materials Available: Ti, Cr, Al, Cu
Standard Dielectric Materials Available: SiO2, Al2O3, ZnO, TiO2, ITO
Approved Substrates: Si, Glass, Pyrex, Quartz
Manufacturer: CHA Industries
Model Number: Discovery 635
| Institute |
Georgia Tech |
| Department |
IEN - Micro/Nano Fabrication Facility |
Sub Tool Of  |
Marcus Inorganic Cleanroom |
| |
Machine Specifications and Data:
Machine Specifications:
- Load-lock for fast pumpdown
- Base pressure: 9e-6 Torr
- Computer controlled
- Can potentially hold 4 different sources for DC or 1 source for RF
- Cathode 1 – RF/DC
- Cathode 2-4 – DC Only
- Utilizes Ar, O2, and N2 Gas
Power Specifications:
- DC Power supply
- Target #3 is dual power and can run either RF or DC power
- Maximum Current for DC Sputtering: 0.3 A
- Maximum Power for RF Sputtering: Bonded Targets: 120 W, Non-bonded Targets: 600 W
- Maximum Temperature for Substrate Heater: 350 °C