Purpose: To anneal or to deposit a layer of polysilicon, doped silicon, wet oxide, dry oxide, nitride, n-type and p-type doping, HTO
Location: Pettit and Marcus Inorganic Cleanrooms
Tools: Tystar Nitride Furnace Tubes 1-4 (Pettit), Tystar Poly Tubes 1-4 (Pettit), Lindberg Furnace Tubes 1-4 (Pettit), Tystar Mini Tubes 1-3 (Marcus)
Supplies Needed: appropriate size boat for sample, all supplies necessary for piranha clean, test wafer/wafer pieces, witness wafer/wafer piece (if necessary)
Setup Procedures:
- Schedule enough time for the tool, well in advance of the process.
- Run a test run to check the deposition rate.
- For a test run, use a similar amount of wafers for a more accurate deposition rate.
- Wafers must be piranha-cleaned immediately before they are put into the furnace (please see the cleaning section for more information).
- Check the furnace tube and make sure it is not flaking.
- Check to make sure the boat necessary for the size wafers you are processing is in the tube.
- If you cannot find the boat you need, check the dry boxes across from the furnaces.
Number of substrates: pieces to 6” wafers, up to a full cassette of 4” wafers
Process Parameters:
- Use the vacuum wand on the furnace to load your wafers onto the furnace boat.
- If necessary, also load witness wafers.
- Load the furnace boat onto the tube shelf.
- Check the furnace periodically while the process is running.
- Make sure the furnace does not go into a special hold (SHLD) step.
- Check and note the parameters to make sure everything stays near the set point.
- Allow the wafers to cool while the boat is out. (5 min)
- If wafers cool too fast, they could shatter.
- Remove the samples from the boat.
- Measure the samples or witness wafers to check the deposition thickness.
- Rerun the samples with the new deposition thickness, if necessary.
- If the deposition is complete, log off the tool and cancel any unused time that was scheduled.
Verification: