Name

Description

Category

Wavelength

Developer

Stripper

SC 1813

• Typical thickness is 1-4 um

SC 1827

• Typical thickness is 1.5-7 um

SPR 220.7.0

• Excellent adhesion and plating characteristics
• Ideal for MEMs and bump processes
• Broadband, g-line and i-line capable
• >10 um film thickness in a single coat with good uniformity (Typically 6-35 um thickness)
• Au, Cu, Ni/Fe plating without cracking
• Recommended to use HMDS for adhesion to some substrates

NR71-3000p

• Straight resist sidewall profile
• Fast develop time
• Superior resolution capability
• Typically for 2-13 um thicknesses
• Temperature resistance of up to 180C
• Superior selectivity in RIE process
• Does not require HMDS 

RR9-1500PY

• Single layer lift off process to pattern metals and dielectrics without RIE
• Sensitivity to wavelengths shorter than 380 nm
• Typically 1.25-3 um thickness
• Superior resolution capability
• Fast develop time
• Temperature resistance of up to 100C