IMS- Micro/Nano Fabrication Facility
Resist Coating Tools
  Tool Location Coating Type (alignment) Chuch Size- (dia. wafer inch) Has Hotplate Material limits  
 

BLE Spinner

Marcus Spin (Manual) 4,6 Yes SU 8 allowed  
 

SCS G3P8

Marcus, Pettit Spin (Manual) small pieces,4,6 No SU 8 allowed  
 

Karl Suss RC8- Marcus

Marcus Spin (Automatic) 4 Yes No SU 8  
 

Karl Suss RC8

Pettit Spin (Manual) 4,6 No No SU 8  
 

Laurell Spinner

Marcus Spin (Manual) small pieces only No Only ferroelectric materials (e.g PZT)  
 

Suess Alta Spray Coater

Marcus Spray (Automatic) 4 No No SU 8  
 

EVG 101 Spinner

Marcus Spin (Automatic) 4 Yes No SU 8  

Spin coating is a procedure used to apply uniform thin films to flat substrates. An excess amount of a solution is placed on the substrate, which is then rotated at high speed in order to spread the fluid by centrifugal force. A machine used for spin coating is called a spin coater, or simply spinner. Rotation is continued while the fluid spins off the edges of the substrate, until the desired thickness of the film is achieved. The applied solvent is usually volatile, and simultaneously evaporates. So, the higher the angular speed of spinning, the thinner the film. The thickness of the film also depends on the concentration of the solution and the solvent.


Spray coating is a unique deposition technique for thin film solar cells and organic solar cells. A broad range of materials can be deposited with spray coating. For sensitive materials coating in inert environment is possible. Substrates with various shapes and topography can be processed. Due to the nature of spray coating scaling to larger substrates or roll-to-roll manufacturing is easy. Spray coating is a very well established manufacturing technology in MEMS and Packaging. 

  Recipie Parameters AZ4620 (10 micron) NR71-3000 p (7 micons) NR21-20000 (7 microns) S1827 (5 micons)  
 

Mixture Ratio [Resist: Acetone: MEK]

1:9:1 1:5:1 1:15:1 1:4:1  
  Chuck Temperature (C) 60 60 60 60  
  Pump Rate (uL/min) 4.0 1.5 1.5 2.8  
  N2 Pressure (bar) 1.5 1.5 1.5 1.5  
  Y Speed (mm/sec) 180 250 250 250  
  Passes 4 4 12 4  
             

 

Contact Information
Hang Chen, Ph.D.
Process Support Manager
The Institute for Electronics and Nanotechnology at Georgia Tech
345 Ferst Drive, Atlanta GA, 30332 | 1152
404.894.3360 | hang.chen@ien.gatech.edu